Relationship between interfacial adhesion and electromigration in Cu metallization
- J.R. Lloyd
- M.W. Lane
- et al.
- 2002
- IIRW 2002
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Time-dependent dielectric breakdown evaluation of deep trench capacitor with sidewall hemispherical, polysilicon grains for gigabit DRAM technology
- Fen Chen
- Porshia Parkinson
- et al.
- 2002
- IIRW 2002