Publications

9 results at IEEE Topical Meeting EPEPS 2003

Using shadow lines to assure accurate signal return current in electrical package analysis codes
- - B.I. Rubin
- 2003
- IEEE Topical Meeting EPEPS 2003
The necesity and consequences of modeling driver and load nonlinearity in on-chip global interconnect noise verification
- - Peter Feldmann
- 2003
- IEEE Topical Meeting EPEPS 2003
Including dispersive dielectrics in PEEC Models
- - Giulio Antonhi
  - Albert E. Ruehlis
  - et al.
- 2003
- IEEE Topical Meeting EPEPS 2003
Package design and measurement of 10 Gbps laser diode on high-speed silicon optical bench
- - Christian Schuster
  - Daniel M. Kuchta
  - et al.
- 2003
- IEEE Topical Meeting EPEPS 2003
Extraction of ε(f) and tan δ(f) for BT Insulator up to 30 GHz Using the Short-Pulse Propagation Technique
- - A. Deutsch
  - T.-M. Winkel
  - et al.
- 2003
- IEEE Topical Meeting EPEPS 2003
Understanding common-mode noise on wide data-buses
- - Alina Deutsch
  - Howard H. Smith
  - et al.
- 2003
- IEEE Topical Meeting EPEPS 2003
Low-Cost ceramic BGA package for 50 Gb/s multiplexing circuit
- - Lei Shan
  - Jean Trewhella
  - et al.
- 2003
- IEEE Topical Meeting EPEPS 2003
Statistical analysis and modelling of low-cost leadless packages for wireless applications based on non-destructive measurements
- - Ullrich Pfeiffer
  - Arun Chandrasekhar
- 2003
- IEEE Topical Meeting EPEPS 2003
A CAD methodology for the characterization of wide on-chip buses
- - I.M. Elfadel
  - A. Deutsch
  - et al.
- 2003
- IEEE Topical Meeting EPEPS 2003