Injection molded solder technology for Pb-free wafer bumping
- P. Gruber
- D.Y. Shih
- et al.
- 2004
- ECTC 2004
Conference paper
Publications
8 results at ECTC 2004
Study of spalling behavior of Intel-metallic compounds during the reaction between electroless Ni-P metallization and lead-free solders
- Yoon-Chul Sohn
- Jin Yu
- et al.
- 2004
- ECTC 2004
Conference paperThermal modeling of a small extreme power density macro on a high power density microprocessor chip in the presence of realistic packaging and interconnect structures
- Kai Xiu
- Mark Ketchen
- 2004
- ECTC 2004
Conference paperSilicon optical bench for high-speed optical subassemblies
- Christian Baks
- Jeremy D. Schaub
- et al.
- 2004
- ECTC 2004
Conference paperThermal impedance measurements of junction-down mounted single-side contact laser diodes
- Guy Cohen
- Lei Shan
- et al.
- 2004
- ECTC 2004
Conference paperEnabling technologies for wafer-level bonding of 3D MEMS and integrated circuit structures
- Anna W. Topol
- Bruce K. Furman
- et al.
- 2004
- ECTC 2004
Conference paper120 Gb/s VCSEL-based parallel optical link and custom 120 Gb/s testing station
- Daniel Kuchta
- Young Kwark
- et al.
- 2004
- ECTC 2004
Conference paperEvaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents
- Sung K. Kang
- Paul Lauro
- et al.
- 2004
- ECTC 2004
Conference paper