Publications

9 results at ECTC 2018

Solder-Reflowable, High-Throughput Fiber Assembly Achieved by Partitioning of Adhesive Functions
- - Alexander Janta-Polczynski
  - Elaine Cyr
  - et al.
- 2018
- ECTC 2018
Conference paper
2D magnetic inductors for DC-DC converters on glass interposer
- - Vincent Lafage
  - Yann Beilliard
  - et al.
- 2018
- ECTC 2018
Conference paper
Injection of Molten Solder (IMS) Technology for Solder Bumping on Wafers, Ceramic/Organic/Flexible Substrates, and Si Via Filling from Fine Pitch to Large Pitch
- - Jae Woong Nah
  - Li-Wen Hung
  - et al.
- 2018
- ECTC 2018
Conference paper
Backward compatible connectors for next generation PCIe electrical I/O
- - Lei Shan
  - Daniel Freidman
  - et al.
- 2018
- ECTC 2018
Conference paper
An Enhanced 64-Element Dual-Polarization Antenna Array Package for W-Band Communication and Imaging Applications
- - Xiaoxiong Gu
  - Duixian Liu
  - et al.
- 2018
- ECTC 2018
Conference paper
Laser Sintering of Dip-Based All-Copper Interconnects
- - Luca Del Carro
  - Martin Kossatz
  - et al.
- 2018
- ECTC 2018
Conference paper
Column Interconnects: A Path Forward for Embedded Cooling of High Power 3D Chip Stacks
- - Mark D. Schultz
  - Cyril Cabral
  - et al.
- 2018
- ECTC 2018
Conference paper
Heterogeneous integration technology demonstrations for future healthcare, IoT, and AI computing solutions
- - John Knickerbocker
  - Russell A. Budd
  - et al.
- 2018
- ECTC 2018
Conference paper
High-speed precision handling technology of micro-chip for fan-out wafer level packaging (FOWLP) application
- - Qianwen Chen
  - Li-Wen Hung
  - et al.
- 2018
- ECTC 2018
Conference paper