Effects of environment on modulus of low-k porous films used in back end of lineEva E. SimonyiChristos D. Dimitrakopouloset al.2007MRS Spring Meeting 2007
Improved electromigration lifetime for copper interconnects using tantalum implantJeff GambinoTimothy D. Sullivanet al.2007MRS Spring Meeting 2007
Application of scatterometry to BEOL measurements: Post Cu CMP measurementsDeepak KulkarniShorn Ponothet al.2007MRS Spring Meeting 2007