Publications

6 results at ECTC 2024

Laser Attach Process Development and material selection
- - Alexander Janta-Polczynski
  - Elaine Cyr
  - et al.
- 2024
- ECTC 2024
Conference paper
A Microstructural Investigation of Sub-1 μm Copper Bonding Contact Structures in Die-to-Wafer Hybrid Bonding
- - Sari Zerey
  - Junghyun Cho
  - et al.
- 2024
- ECTC 2024
Conference paper
Ultra-Compact Computing at the Edge Involving Unobtrusively Small Sub-millimeter Heterogeneous Integration Packaging
- - Frank Libsch
  - Steve Bedell
  - et al.
- 2024
- ECTC 2024
Conference paper
Electromigration Kinetics of SAC/SnBiAg Hybrid Solder
- - Minhua Lu
  - Evan Colgan
- 2024
- ECTC 2024
Conference paper
Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 μm-Pitch Solder Joints
- - Akihiro Horibe
  - Takahito Watanabe
  - et al.
- 2024
- ECTC 2024
Conference paper
Reliable Chiplet Integration on High Density Laminate (2.X D) for AI Hardware
- - Divya Taneja
  - Jonathan Grenier
  - et al.
- 2024
- ECTC 2024
Conference paper