Publications

3 results at ICEPT-HDP 2008

C4NP for Pb-free solder wafer bumping and 3D fine-pitch applications
- - D.Y. Shih
  - B. Dang
  - et al.
- 2008
- ICEPT-HDP 2008
Electromigration in Pb-free solders
- - Minhua Lu
  - Da-Yuan Shih
  - et al.
- 2008
- ICEPT-HDP 2008
High density 3D integration
- - Roy Yu
- 2008
- ICEPT-HDP 2008