Publications

3 results at International Workshop on Stress-Induced Phenomena in Metallization 2008

The evolution of barrier properties during reliability testing of Cu interconnects
- - M.A. Meyer
  - O. Aubel
  - et al.
- 2008
- International Workshop on Stress-Induced Phenomena in Metallization 2008
Electromigration challenges for nanoscale Cu wiring
- - C.-K. Hu
  - L. Gignac
  - et al.
- 2008
- International Workshop on Stress-Induced Phenomena in Metallization 2008
Stress relaxation in Cu thin films
- - C. Witt
  - R. Rosenberg
  - et al.
- 2008
- International Workshop on Stress-Induced Phenomena in Metallization 2008