Optimization of SiCOH dielectrics for integration in a 90 nm CMOS technology
- A. Grill
- D. Edelstein
- et al.
- 2004
- IITC 2004
Conference paper
Publications
7 results at IITC 2004
Optimal implementation of sea of leads (SoL) compliant interconnect technology
- Bing Dang
- Chirag Patel
- et al.
- 2004
- IITC 2004
Conference paperChip-to-Package Interaction for a 90 nm Cu / PECVD Low-k technology
- W. Landers
- D. Edelstein
- et al.
- 2004
- IITC 2004
Conference paperReliability, yield, and performance of a 90 nm SOI/Cu/SiCOH technology
- D. Edelstein
- C.R. Davis
- et al.
- 2004
- IITC 2004
Conference paperChannel cracking in low-k films on patterned multi-layers
- X.-H. Liu
- T.M. Shaw
- et al.
- 2004
- IITC 2004
Conference paperIntegrated electro-chemical mechanical planarization (Ecmp) for future generation device technology
- L. Economikos
- X. Wang
- et al.
- 2004
- IITC 2004
Conference paperAsh-induced modification of porous and dense SiCOH inter-level-dielectric (ILD) materials during damascene plasma processing
- T. Dalton
- N. Fuller
- et al.
- 2004
- IITC 2004
Conference paper