Electrical Performance of Hybrid Bonding with Sub-Micron Cu-Cu Bonding Contacts: Effects of Scaling, Microstructure, and Surface MorphologySari ZereyAlina Bennett-dubinet al.2025ECTC 2025
Fast And Accurate Machine Learning Prediction of Back-End-Of-Line Thermal Resistances in Backside Power Delivery and Chiplet ArchitecturesPrabudhya Roy ChowdhuryAakrati Jainet al.2025ECTC 2025
A Multiscale Workflow for Thermal Analysis of 3DI Chip StacksMax BloomfieldAmogh Wastiet al.2025ITherm 2025
A framework for analog-digital mixed-precision neural network training and inferenceA. VasilopoulosEmma Boulhartset al.2025ISCAS 2025
Live Demonstration: Automated DNN Deployment on the IBM HERMES Project ChipCorey Liam LammieJulian Büchelet al.2025ISCAS 2025
How AI can accelerate Materials Discovery for CO2 CaptureMathias Steiner2025Canadian Separations Symposium 2025
POKE: A Compact and Efficient PKE from Higher-dimensional IsogeniesAndrea BassoLuciano Maino2025Eurocrypt 2025
Segmentation of subretinal and intraretinal fluid on OCT B-scans using an easily fine-tunable and deployable, visual-prompting based computer vision modelRui SantosThomas Fricket al.2025ARVO 2025
Integer Programming Based Methods and Heuristics for Causal Graph LearningSanjeeb DashJoao Goncalveset al.2025AISTATS 2025