The microstructure, mechanical stress, texture, and electromigration behavior of Al-Pd alloys
- K.P. Rodbell
- D.B. Knorr
- et al.
- 1993
- Journal of Electronic Materials
Paper
Publications
14468 results for Physical Sciences
Thermal energy of the crystalline one-component plasma from dynamical simulations
- R.T. Farouki
- S. Hamaguchi
- 1993
- Physical Review E
PaperOptical properties of planar and selectively grown SiGe/Si multiple quantum wells
- Detlev A. Grützmacher
- Thomas O. Sedgwick
- et al.
- 1993
- SPIE Physical Concepts of Materials for Novel Optoelectronic Device Applications 1993
Conference paperInterface reactions with formation of a solid phase on a solid substrate: a short overview
- F.M. d'Heurle
- 1993
- MSF
PaperElectromigration and current-carrying implications for aluminum-based metallurgy with tungsten stud-via interconnections
- H.S. Rathore
- R. Filippi
- et al.
- 1992
- SPIE Microelectronic Processing 1992
Conference paperEffect of strain on diffusion kinetics and activation energy for al grain-boundary diffusion: A computer simulation
- Thomas Kwok
- 1992
- SPIE Microelectronic Processing 1992
Conference paperPerformance consideration for the scaling of sub-micron on-chip interconnections
- Yuh-Jier Mii
- 1992
- SPIE Microelectronic Processing 1992
Conference paperElectromigration and stress reliability in multilevel interconnect metallization
- Paul S. Ho
- M.A. Moske
- et al.
- 1992
- SPIE Microelectronic Processing 1992
Conference paperEffects of texture, microstructure, and alloy content on electromigration of aluminum-based metallization
- D.B. Knorr
- K.P. Rodbell
- 1992
- SPIE Microelectronic Processing 1992
Conference paperThe adsorption structure of 2,5-dihydrothiophene on Mo(110)-(4 × 1)-S: ring orientation as determined by NEXAFS
- Han Xu
- Per Uvdal
- et al.
- 1993
- Surface Science
Paper