Effective Cu surface pre-treatment for high-reliable 22nm-node Cu dual damascene interconnects with high plasma resistant ultra low-k dielectric (k=2.2)
- F. Ito
- H. Shobha
- et al.
- 2010
- ADMETA 2010
Conference paper
Publications
26856 results for Science
Smaller, smarter, faster, and more accurate: The new overlay metrology
- 2010
- SPIE Advanced Lithography 2010
Conference paperUsing simulation-based stochastic approximation to optimize staffing of systems with skills-based-routing
- Zohar Feldman
- Avishai Mandelbaum
- 2010
- WSC 2010
Conference paperCD-SEM metrology of spike detection on sub-40 nm contact holes
- Yoshinori Momonoi
- Taro Osabe
- et al.
- 2010
- SPIE Advanced Lithography 2010
Conference paperExtending a model-driven engineering environment to support product line engineering
- Dolev Dotan
- Tomer Amarilio
- et al.
- 2010
- ECMFA 2010
Workshop paperContext slices: Representing contexts in OWL
- Chris Welty
- 2010
- ISWC 2010
Workshop paperNonvolatile polymer memory with nanoconfinement of ferroelectric crystals
- Seok Ju Kang
- Insung Bae
- et al.
- 2010
- Nano Letters
PaperAdvanced metallization developments for 32-nm node CMOS technology contact architecture
- Doug H. Lee
- Valli Arunachalam
- et al.
- 2009
- ADMETA 2009
Conference paperA decision theoretic approach to data leakage prevention
- Janusz Marecki
- Mudhakar Srivatsa
- et al.
- 2010
- SocialCom/PASSAT 2010
Conference paperCoWP metal caps for reliable 32 nm 1X Cu interconnects in porous ULK (k=2.4)
- E. Huang
- M. Oh
- et al.
- 2009
- ADMETA 2009
Conference paper