Wire bond behavior during molding operations of electronic packages
- L.T. Nguyen
- 2004
- Polymer Engineering & Science
Publications
45 results at Polymer Engineering & Science
Effect of tensile strain, time, and temperature on gas transport in biaxially oriented polystyrene
- Giovanni Levita
- Thor L. Smith
- 2004
- Polymer Engineering & Science
Strength of elastorners—a perspective
- Thor L. Smith
- 2004
- Polymer Engineering & Science
Thickness‐direction thermal expansion of polyimide films
- Ho-Ming Tong
- K.L. Saenger
- et al.
- 1993
- Polymer Engineering & Science
Thermoplastic character of polyimide blends
- B.J. Han
- Jae M. Park
- et al.
- 1993
- Polymer Engineering & Science