Effects of mechanical stress and moisture on packaging interfaces
- Stephen L. Buchwalter
- Peter J. Brofman
- et al.
- 2005
- IBM J. Res. Dev
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Logic-based eDRAM: Origins and rationale for use
- Richard E. Matick
- Stanley E. Schuster
- 2005
- IBM J. Res. Dev
Microminiature packaging and integrated circuitry: The work of E. F. Rent, with an application to on-chip interconnection requirements
- Mary Yvonne Lanzerotti
- Giovanni Fiorenza
- et al.
- 2005
- IBM J. Res. Dev
BladeCenter solutions
- Lynn S. Fore
- David W. Cosby
- et al.
- 2005
- IBM J. Res. Dev
Exploitation of optical interconnects in future server architectures
- Alan F. Benner
- Michael Ignatowski
- et al.
- 2005
- IBM J. Res. Dev
Low-cost wafer bumping
- Peter A. Gruber
- Luc Bélanger
- et al.
- 2005
- IBM J. Res. Dev
Recent developments in high-moment electroplated materials for recording heads
- Emanuel I. Cooper
- Christian Bonhôte
- et al.
- 2005
- IBM J. Res. Dev
The evolution of build-up package technology and its design challenges
- Edmund D. Blackshear
- Moises Cases
- et al.
- 2005
- IBM J. Res. Dev
LORE: An infrastructure to support location-aware services
- Ying Chen
- Xiao Yan Chen
- et al.
- 2004
- IBM J. Res. Dev
Evolution of a Java just-in-time compiler for IA-32 platforms
- Toshio Suganuma
- Takeshi Ogasawara
- et al.
- 2004
- IBM J. Res. Dev