Latent defect screening for high-reliability glass-ceramic multichip module copper interconnects
- Edward J. Yarmchuk
- Christopher W. Cline
- et al.
- 2005
- IBM J. Res. Dev
Publications
745 results at IBM J. Res. Dev
Design and implementation of message-passing services for the Blue Gene/L supercomputer
- George Almási
- Charles Archer
- et al.
- 2005
- IBM J. Res. Dev
BladeCenter solutions
- Lynn S. Fore
- David W. Cosby
- et al.
- 2005
- IBM J. Res. Dev
The evolution of build-up package technology and its design challenges
- Edmund D. Blackshear
- Moises Cases
- et al.
- 2005
- IBM J. Res. Dev
Recent developments in high-moment electroplated materials for recording heads
- Emanuel I. Cooper
- Christian Bonhôte
- et al.
- 2005
- IBM J. Res. Dev
Low-cost wafer bumping
- Peter A. Gruber
- Luc Bélanger
- et al.
- 2005
- IBM J. Res. Dev
Microminiature packaging and integrated circuitry: The work of E. F. Rent, with an application to on-chip interconnection requirements
- Mary Yvonne Lanzerotti
- Giovanni Fiorenza
- et al.
- 2005
- IBM J. Res. Dev
Exploitation of optical interconnects in future server architectures
- Alan F. Benner
- Michael Ignatowski
- et al.
- 2005
- IBM J. Res. Dev
Finishing line scheduling in the steel industry
- Hiroyuki Okano
- Andrew J. Davenport
- et al.
- 2004
- IBM J. Res. Dev
Evolution of a Java just-in-time compiler for IA-32 platforms
- Toshio Suganuma
- Takeshi Ogasawara
- et al.
- 2004
- IBM J. Res. Dev