Fabrication of Tungsten Local Interconnect for VLSI Bipolar Technology
- N.J. Mazzeo
- J.D. Warnock
- et al.
- 1993
- JES
Paper
Publications
509 results at JES
The Influence of Lithographic Patterning on Current Distribution in Electrodeposition: Experimental Study and Mass-Transfer Effects
- H.Y. Cheh
- J. Dukovic
- et al.
- 1993
- JES
PaperHigh-Resolution Depth Profiling of Ultrathin Silicon Oxide/Nitride/Oxide Layers
- G.M.W. Kroesen
- G.S. Oehrlein
- et al.
- 1993
- JES
PaperElectrical Resistance and Stress of Bilayer Co(P)/Cu and Ni(P)/Cu Thin Films
- M. Paunovic
- L. Clevenger
- et al.
- 1993
- JES
PaperCorrosion Inhibition of Cobalt with a Thin Film of Cu-BTA
- B.M. Rush
- G.S. Frankel
- et al.
- 1993
- JES
PaperChemical Vapor Deposited Copper from Alkyne Stabilized Copper (I) Hexafluoroacetylacetonate Complexes
- Thomas H. Baum
- Carl E. Larson
- 1993
- JES
PaperConditions for an Oxide-Free Si Surface for Low-Temperature Processing: Steady-State Boundary
- P. Agnello
- T.O. Sedgwick
- 1992
- JES
PaperThe Influence of Lithographic Patterning on Current Distribution: A Model for Microfabrication by Electrodeposition
- H.Y. Cheh
- J. Dukovic
- et al.
- 1992
- JES
PaperSome Factors Affecting Hillock Formation due to PECVD Processing of Sputtered Al-4% Cu-1% Si Films
- V.J. Minkiewicz
- J.O. Moore
- et al.
- 1992
- JES
PaperNew High-Resolution and High-Sensitivity Deep UV, X-Ray, and Electron-Beam Resists
- M. Hatzakis
- K.J. Stewart
- et al.
- 1991
- JES
Paper