Effect of mask wall angle on shape evolution during through-mask electrochemical micromachiningR.V. ShenoyM. Datta1996JES
Impact of the electrochemical properties of silicon wafer surfaces on copper outplating from HF solutionsI. TeerlinckP.W. Mertenset al.1996JES
PECVD Silicon Nitride as a Gate Dielectric for Amorphous Silicon Thin Film Transistor Process and Device PerformanceYue Kuo1995JES