Electrodeposition of Ni from low-temperature sulfamate electrolytes
- S.H. Goods
- J. Kelly
- et al.
- 2006
- JES
Paper
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509 results at JES
Electrodeposition of gold on silicon nucleation and growth phenomena
- Q. Huang
- H. Deligianni
- et al.
- 2006
- JES
PaperElectrodeposition of Ni from low-temperature sulfamate electrolytes
- J. Kelly
- S.H. Goods
- et al.
- 2006
- JES
PaperElectrochemical characterization of adsorption-desorption of the cuprous-suppressor-chloride complex during electrodeposition of copper
- John G. Long
- Peter C. Searson
- et al.
- 2006
- JES
PaperNumerical simulation of electrochemical planarization of copper overburden
- Alan C. West
- Ingrid Shao
- et al.
- 2005
- JES
PaperEvaluation of thermal stability for CMOS gate metal materials
- C. Cabral Jr.
- C. Lavoie
- et al.
- 2004
- JES
PaperSecond-order normal force brought about by polishing with a polyurethane pad
- Maria Ronay
- 2004
- JES
PaperInteraction of hydrogen plasma with extreme low-k SiCOH dielectrics
- A. Grill
- V.V. Patel
- 2004
- JES
PaperComparison of {311} Defect Evolution in SIMOX and Bonded SOI Materials
- A.F. Saavedra
- K.S. Jones
- et al.
- 2004
- JES
PaperAbrupt Phosphorus Profiles in Si: Effects of Temperature and Substitutional Carbon on Phosphorus Autodoping
- D. Singh
- J.L. Hoyt
- et al.
- 2003
- JES
Paper