Enhanced grain growth of electroplated copper on cobalt-containing seed layer
- Q. Huang
- B.C. Baker-O'Neal
- et al.
- 2013
- JES
Paper
Publications
509 results at JES
Mechanism of co liner as enhancement layer for Cu interconnect gap-fill
- M. He
- X. Zhang
- et al.
- 2013
- JES
PaperA diffusion barrier for flexible thin film photovoltaics
- Lian Guo
- Maurice Mason
- et al.
- 2013
- JES
PaperElectrolyte additive chemistry and feature size-dependent impurity incorporation for Cu interconnects
- J. Kelly
- Takeshi Nogami
- et al.
- 2012
- JES
PaperLeveler effect and oscillatory behavior during copper electroplating
- Q. Huang
- B.C. Baker-O'Neal
- et al.
- 2012
- JES
PaperEvidence of crystallization-induced segregation in the phase change material Te-rich GST
- Anthony Debunne
- Kumar Virwani
- et al.
- 2011
- JES
PaperA Manufacturing grade, porous oxycarbosilane spin-on dielectric candidate with K 2.0
- Willi Volksen
- Teddie P. Magbitang
- et al.
- 2011
- JES
PaperIdentifying capacity limitations in the Li/oxygen battery using experiments and modeling
- Paul Albertus
- Girish Girishkumar
- et al.
- 2011
- JES
PaperElectrochemical and spectroscopic investigations of the overcharge behavior of StabiLife electrolyte salts in lithium-ion batteries
- Girish Girishkumar
- Wade H. Bailey III
- et al.
- 2011
- JES
PaperElectrodeposition of indium on copper for CIS and CIGS solar cell applications
- Q. Huang
- Kathleen B. Reuter
- et al.
- 2011
- JES
Paper