Fundamental Study of Acid Copper Through-Hole Electroplating Process
- Edward K. Yung
- Lubomyr T. Romankiw
- 2019
- JES
Publications
509 results at JES
A Mathematical Model for Silicide Oxidation
- S.-L. Zhang
- R. Ghez
- et al.
- 2019
- JES
Combined Experimental and Modeling Study of Spatial Effects in Plasma Etching: CF4/O2 Etching of Silicon
- M. Dalvie
- K.F. Jensen
- 2019
- JES
Optimization of Electrodeposit Uniformity by the Use of Auxiliary Electrodes
- S. Mehdizadeh
- J. Dukovic
- et al.
- 2019
- JES
Factors Affecting the Molybdenum Line Slope by Reactive Ion Etching
- Yue Kuo
- 2019
- JES
Heating Effects In Reactive Etching Of Nb And Nb205
- Young H. Lee
- 2019
- JES
Substituent Effect on Para-Substituted n-phenylpyrrole Monomers and Their Polyheterocyclic Conductors
- M.C. Rock
- Ma. Eugenia Carbajal
- et al.
- 2019
- JES
Oxidation of Plasma-Deposited α-SixC1-x:H Films
- J.M. Eldridge
- J.O. Moore
- et al.
- 2019
- JES
Electrochemical Properties of Polyimides and Related Imide Compounds
- A. Viehbeck
- M.J. Goldberg
- et al.
- 2019
- JES
Electroplated Magnetic Media with Vertical Anisotropy
- Jean Horkans
- I-Chia Hsu Chang
- et al.
- 2019
- JES