Grain-size effects in the indentation fracture of MgO
- R.F. Cook
- E. Liniger
- 1992
- Journal of Materials Science
Paper
Publications
3555 results for Materials Discovery
Thermal stress analysis of pin grid array structures: Module and card interactions
- P.A. Engel
- J.R. Webb
- 1992
- ASME Journal of Electronic Packaging
PaperInvestigations on the quality of polysilicon film-gate dielectric interface in polysilicon thin film transistors
- Ji-Ho Kung
- Miltiadis K. Hatalis
- et al.
- 1992
- Thin Solid Films
PaperVacuum ultraviolet spectroscopy of the optical properties and electronic structure of seven poly(di-alkylsilanes)
- R.H. French
- J.S. Meth
- et al.
- 1992
- Synthetic Metals
PaperElectronic structure in confined volumes using spatially resolved electron energy loss scattering
- P.E. Batson
- 1992
- Materials Science and Engineering B
PaperScanning tunneling microscopy of surfactant-mediated epitaxy of Ge on Si(111): strain relief mechanisms and growth kinetics
- Gerhard Meyer
- Bert Voigtländer
- et al.
- 1992
- Surface Science
PaperReactive diffusion in a prototype system: nickel-aluminum I: Non-constant diffusion coefficient
- F.M. d'Heurle
- R. Ghez
- 1992
- Thin Solid Films
PaperReactive diffusion in a prototype system: nickel - aluminum II: The ordered Cu3Au rule and the sequence of phase formation, nucleation
- F.M. d'Heurle
- R. Ghez
- 1992
- Thin Solid Films
PaperMagnetic head-media interface temperatures-part 3: Application to rigid disks
- B. Bhushan
- 1992
- Journal of Tribology
PaperReply to "comment on 'Cr LVV Auger emission and photoreduction of hexavalent Cr oxides' by E. Paparazzo"
- A.G. Schrott
- G.S. Frankel
- et al.
- 1992
- Surface Science
Paper