Extending the compositional diversity of films in area selective atomic layer deposition through chemical functionalitiesMagi MettryAlexander E. Hesset al.2019JVSTA
Achieving ultrahigh etching selectivity of SiO2 over Si3N4 and Si in atomic layer etching by exploiting chemistry of complex hydrofluorocarbon precursorsKang Yi LinChen Liet al.2018JVSTA
Review Article: Stress in thin films and coatings: Current status, challenges, and prospectsGrégory AbadiasEric Chasonet al.2018JVSTA
Effects of cesium ion implantation on the mechanical and electrical properties of porous SiCOH low- k dielectricsWeiyi LiDongfei Peiet al.2017JVSTA
Cyclic Cl2/H2 quasi-atomic layer etching approach for TiN and TaN patterning using organic masksNathan MarchackJ. M. Papaliaet al.2017JVSTA
Effects of ultraviolet and vacuum ultraviolet synchrotron radiation on organic underlayers to modulate line-edge roughness of fine-pitch poly-silicon patternsHiroyuki MiyazoeSebastian U. Engelmannet al.2017JVSTA
Early example of an interdisciplinary approach in industry: Harold F. Winters's contributionsEric KayJohn W. Coburn2017JVSTA
Atomic layer deposited ultrathin metal nitride barrier layers for ruthenium interconnect applicationsSonal DeyKai-Hung Yuet al.2017JVSTA
Initial evaluation and comparison of plasma damage to atomic layer carbon materials using conventional and low Te plasma sourcesAshish JagtianiHiroyuki Miyazoeet al.2016JVSTA
Application of cyclic fluorocarbon/argon discharges to device patterningDominik MetzlerKishore Uppireddiet al.2016JVSTA