Benchmarking Power Delivery Network Designs at the 5-nm Technology Node
- Nicholas A. Lanzillo
- Albert M. Chu
- et al.
- 2021
- IEEE T-ED
Paper
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465 results at IEEE T-ED
Fully On-Chip MAC at 14 nm Enabled by Accurate Row-Wise Programming of PCM-Based Weights and Parallel Vector-Transport in Duration-Format
- Pritish Narayanan
- Stefano Ambrogio
- et al.
- 2021
- IEEE T-ED
PaperNoise-Resilient DNN: Tolerating Noise in PCM-Based AI Accelerators via Noise-Aware Training
- Sanjay Kariyappa
- Hsinyu Tsai
- et al.
- 2021
- IEEE T-ED
PaperHeterogeneous integration of III-V materials by direct wafer bonding for high-performance electronics and optoelectronics
- Daniele Caimi
- Preksha Tiwari
- et al.
- 2021
- IEEE T-ED
PaperSpatially Resolved Diffusion of Aluminum in 4H-SiC during Postimplantation Annealing
- Johanna Muting
- Viktor Bobal
- et al.
- 2020
- IEEE T-ED
PaperImpact of hot-carrier degradation on drain-induced barrier lowering in multifin SOI n-Channel FinFETs with self-heating
- Charu Gupta
- Anshul Gupta
- et al.
- 2020
- IEEE T-ED
PaperFacts and Myths of Dielectric Breakdown Processes-Part II: Post-Breakdown and Variability
- Ernest Y. Wu
- 2019
- IEEE T-ED
PaperFacts and Myths of Dielectric Breakdown Processes-Part I: Statistics, Experimental, and Physical Acceleration Models
- Ernest Y. Wu
- 2019
- IEEE T-ED
PaperLow-Noise Schottky Junction Trigate Silicon Nanowire Field-Effect Transistor for Charge Sensing
- Xi Chen
- Si Chen
- et al.
- 2019
- IEEE T-ED
PaperReliability Modeling and Analysis of Hot-Carrier Degradation in Multiple-Fin SOI n-Channel FinFETs With Self-Heating
- Anshul Gupta
- Charu Gupta
- et al.
- 2019
- IEEE T-ED
Paper