IMC bonding for 3D interconnection
- Katsuyuki Sakuma
- Kuniaki Sueoka
- et al.
- 2010
- ECTC 2010
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12 results at ECTC 2010
CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration
- Bing Dang
- Paul Andry
- et al.
- 2010
- ECTC 2010