Wafer-level non conductive films for exascale servers
- Akihiro Horibe
- Sayuri Kohara
- et al.
- 2014
- ECTC 2014
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17 results at ECTC 2014
Time, temperature, and mechanical fatigue dependence on underfill adhesion
- Joseph Cremaldi
- Michael Gaynes
- et al.
- 2014
- ECTC 2014
Modeling of switching noise and coupling in multiple chips of 3D TSV-based systems
- Huanyu He
- Xiaoxiong Gu
- et al.
- 2014
- ECTC 2014
Effect of Ag and Cu content in Sn based Pb-free solder on electromigration
- Minhua Lu
- Charles Goldsmith
- et al.
- 2014
- ECTC 2014
A compact 4-chip package with 64 embedded dual-polarization antennas for W-band phased-array transceivers
- Xiaoxiong Gu
- Duixian Liu
- et al.
- 2014
- ECTC 2014
Assembly and packaging of non-bumped 3D chip stacks on bumped substrates
- Bing Dang
- Joana Maria
- et al.
- 2014
- ECTC 2014
Nanofiller based spin-on materials for negligible reflection of silicon photonic external coupling
- Yoichi Taira
- Ryuma Mizusawa
- et al.
- 2014
- ECTC 2014