Silicon photonics packaging for highly scalable optical interconnects
- Antonio La Porta
- Jonas Weiss
- et al.
- 2015
- ECTC 2015
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18 results at ECTC 2015
Through silicon via process for effective multi-wafer integration
- Akihiro Horibe
- Kuniaki Sueoka
- et al.
- 2015
- ECTC 2015
Dual-side cooling for a three-dimensional (3D) chip stack : Additional cooling from the laminate (substrate) side
- Keiji Matsumoto
- Hiroyuki Mori
- et al.
- 2015
- ECTC 2015
A multilayer organic package with four integrated 60GHz antennas enabling broadside and end-fire radiation for portable communication devices
- Xiaoxiong Gu
- Duixian Liu
- et al.
- 2015
- ECTC 2015
Simulation of thermal pulse evolution during laser debonding
- Bucknell Webb
- Paul Andry
- 2015
- ECTC 2015
Automated, self-aligned assembly of 12 fibers per nanophotonic chip with standard microelectronics assembly tooling
- Tymon Barwicz
- Nicolas Boyer
- et al.
- 2015
- ECTC 2015
Electromigration and thermal migration in Pb-free interconnects
- Minhua Lu
- Thomas Wassick
- et al.
- 2015
- ECTC 2015
Flip chip assembly with sub-micron 3D re-alignment via solder surface tension
- Jae Woong Nah
- Yves Martin
- et al.
- 2015
- ECTC 2015