Embedded power insert enabling dual-side cooling of microprocessorsThomas BrunschwilerDominic Gschwendet al.2015ECTC 2015
Electromigration and thermal migration in Pb-free interconnectsMinhua LuThomas Wassicket al.2015ECTC 2015
Through silicon via process for effective multi-wafer integrationAkihiro HoribeKuniaki Sueokaet al.2015ECTC 2015
Silicon photonics packaging for highly scalable optical interconnectsAntonio La PortaJonas Weisset al.2015ECTC 2015
An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substratesKatsuyuki SakumaKrishna Tungaet al.2015ECTC 2015
Planarity-tolerant fine-pitch reworkable interconnections with sharp protrusions and microbumpsY. LiuSteven L. Wrightet al.2015ECTC 2015