Publications

13 results at IITC 2017

Resistivity of copper interconnects at 28 nm pitch and copper cross-sectional area below 100 nm²
- - Adam Pyzyna
  - Hsinyu Tsai
  - et al.
- 2017
- IITC 2017
Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines
- - Takeshi Nogami
  - Raghuveer Patlolla
  - et al.
- 2017
- IITC 2017
Planarity considerations in SADP for advanced BEOL patterning
- - James H.-C. Chen
  - Terry A. Spooner
  - et al.
- 2017
- IITC 2017