Integrated dual SPE processes with low contact resistivity for future CMOS technologiesHeng WuSoon-Cheon Seoet al.2017IEDM 2017
Modeling of NBTI time kinetics and T dependence of VAF in SiGe p-FinFETsNarendra PariharRichard G. Southwicket al.2017IEDM 2017
Fully aligned via integration for extendibility of interconnects to beyond the 7 nm nodeBenjamin D. BriggsC.B. Peethalaet al.2017IEDM 2017
A novel 25 Gbps electro-optic Pockels modulator integrated on an advanced Si photonic platformFelix EltesMarcel Krohet al.2017IEDM 2017
Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integrationThomas BrunschwilerGerd Schlottiget al.2017IEDM 2017