Uniform copper electroplating on resistive substrates
- Rui Fang
- Keisuke Namiki
- et al.
- 2004
- ECS Meeting 2004
Conference paper
Publications
17 results at ECS Meeting 2004
Immersion plating of bismuth on tin-based alloys to stabilize lead-free solders
- Emanuel I. Cooper
- Charles C. Goldsmith
- et al.
- 2004
- ECS Meeting 2004
Conference paperComparison of FECO films plated from an ammonium-containing sulfate bath and a SBA-containing sulfate bath
- Ingrid Shao
- Lubomyr T. Romankiw
- et al.
- 2004
- ECS Meeting 2004
Conference paperModeling of germanium and antimony diffusion in Si1.xGe x
- Huilong Zhu
- 2004
- ECS Meeting 2004
Conference paperStrained-silicon / silicon-germanium-on-insulator for high-performance CMOS : A manufacturable process for 300 mm substrates
- A. Reznicek
- S.W. Bedell
- et al.
- 2004
- ECS Meeting 2004
Conference paperSiGe MODFETS: Overview and issues for sub-100 nm gate-length scaling
- S.J. Koester
- K.L. Saenger
- et al.
- 2004
- ECS Meeting 2004
Conference paperSub-30 NM abrupt junction formation in strained silicon/silicon-germanium CMOS device
- K.-L. Lee
- F. Cardone
- et al.
- 2004
- ECS Meeting 2004
Conference paper