Formation of polyimide–Cu complexes: improvement of direct Cu-on-PI and PI-on-Cu adhesion
- K.-W. Lee
- G.F. Walker
- et al.
- 1995
- Journal of Adhesion Science and Technology
Paper
Publications
3552 results for Materials Discovery
Plasma enhanced chemical vapor deposition of TiO2 in microwave-radio frequency hybrid plasma reactor
- Young H. Lee
- Kevin K. Chan
- et al.
- 1995
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
PaperA comparison of C54-TiSi2 formation in blanket and submicron gate structures using in situ x-ray diffraction during rapid thermal annealing
- J. Bucchignano
- G.B. Stephenson
- et al.
- 1995
- Journal of Materials Research
PaperSpin-polarized electron tunneling: The importance of the potential barrier shape
- S.F. Alvarado
- 1995
- Materials Science and Engineering B
PaperReactions of Complex Ions of Platinum and Palladium in Langmuir-Blodgett Films of Metal Arachidates
- David J. Elliot
- D. Neil Furlong
- et al.
- 1995
- Langmuir
PaperBe delta-doped layers in GaAs studied by scanning tunnelling microscopy
- P.M. Koenraad
- M. Johnson
- et al.
- 1995
- Materials Science and Engineering B
PaperElectron dynamics at surfaces
- Richard Haight
- 1995
- Surface Science Reports
PaperGlass formation from low molecular weight organic melts
- Seong-Jin Kim
- Tom Karis
- 1995
- Journal of Materials Research
PaperUse of high temperature and high humidity to test the adhesion of sputtered copper to a polyimide surface modified by an ac nitrogen glow discharge
- J.B. Ma
- J. Dragon
- et al.
- 1995
- Journal of Adhesion Science and Technology
PaperCompositional and Electrical Properties of Si Metal-Oxide-Semiconductor Structure Prepared by Direct Photoenhanced Chemical Vapor Deposition using a Deuterium Lamp
- E. Machler
- E.J. Williams
- et al.
- 1995
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Paper