Publications

509 results at JES

Phosphorus-Doped Polycrystalline Silicon via LPCVD: I. Process Characterization
- - B.S. Meyerson
  - W.L. Olbricht
- 2019
- JES
Paper
Calculation of Galvanic Currents and Potentials Using a p-Type Finite Element Method
- - R.B. Morris
- 2019
- JES
Paper
Growth of Facet-Free Selective Silicon Epitaxy at Low Temperature and Atmospheric Pressure
- - T.O. Sedgwick
  - P. Agnello
  - et al.
- 2019
- JES
Paper
Plating of Copper into Through-Holes and Vias
- - Richard C. Alkire
  - Lubomyr T. Romankiw
- 2019
- JES
Paper
Fundamental Study of Acid Copper Through-Hole Electroplating Process
- - Edward K. Yung
  - Lubomyr T. Romankiw
- 2019
- JES
Paper
Pd+2/poly(acrylic acid) thin films as catalysts for electroless copper deposition: Mechanism of catalyst formation
- - Robert L. Jackson
- 2019
- JES
Paper
Electrodeposition of Nickel-Iron Alloys: 1. Effect of Agitation
- - P.C. Andricacos
  - C. Arana
  - et al.
- 2019
- JES
Paper
Reactive Ion Etching of GaAs in Chlorine and Resulting Surface Damage
- - B.S. Lee
  - H. Baratte
- 2019
- JES
Paper
Diffusion of Ion-Implanted Arsenic in Thermally Grown SiO₂Films
- - D.R. Young
  - H. Kräutle
  - et al.
- 2019
- JES
Paper
Redeposition during Deep Trench Etching
- - Jacob Jorne
- 2019
- JES
Paper