Publications

2 results for A.T. Pfeiffer

The application of electrodeposition processes to advanced package fabrication
- - S. Krongelb
  - J. Dukovic
  - et al.
- 1990
- SPIE Advances in Intelligent Robotics Systems 1990
Conference paper
Advantages and special considerations in fabricating bubble circuits by electroplating and sputter etching
- - L. Romankiw
  - S. Krongelb
  - et al.
- 1974
- IEEE Transactions on Magnetics
Paper