Segregation of copper in dilute aluminum-copper alloys for interconnects
- D.A. Smith
- M.B. Small
- et al.
- 1994
- MRS Spring Meeting 1994
Publications
42 results for M.B. Small
Electromigration in Al(Cu) two-level structures: Effect of Cu and kinetics of damage formation
- C.-K. Hu
- M.B. Small
- et al.
- 1993
- Journal of Applied Physics
Electromigration failure due to interfacial diffusion in fine Al alloy lines
- C.-K. Hu
- M.B. Small
- et al.
- 1993
- Applied Physics Letters
Elecromigration damage in fine Al alloy lines due to interfacial diffusion
- C.-K. Hu
- M.B. Small
- et al.
- 1993
- MRS Proceedings 1993
Electron microscopy of the grain structure of metal films and lines
- David A. Smith
- Martin Small
- et al.
- 1993
- Ultramicroscopy
Electromigration in two-level interconnect structures with Al alloy lines and W studs
- C.-K. Hu
- P.S. Ho
- et al.
- 1992
- Journal of Applied Physics
Selection of solutes for improving electromigration resistance of metals: A new insight
- M.B. Small
- D.A. Smith
- 1992
- Applied Physics Letters
Dry etching of TiN/Al(Cu)/Si for very large scale integrated local interconnections
- K.W. Choi
- N.J. Mazzeo
- et al.
- 1990
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
On-chip wiring for VLSI. Status and directions
- M.B. Small
- D.J. Pearson
- 1990
- IBM J. Res. Dev
A process for improved Al (Cu) reactive ion etching
- C.-K. Hu
- B. Canney
- et al.
- 1989
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films