Threshold electromigration failure time and its statistics for Cu interconnects
- Baozhen Li
- Cathryn Christiansen
- et al.
- 2006
- Journal of Applied Physics
Publications
38 results for Emmanuel Yashchin
Application of three-parameter lognormal distribution in EM data analysis
- Baozhen Li
- Emmanuel Yashchin
- et al.
- 2006
- Microelectronics Reliability
Minimum void size and 3-parameter lognormal distribution for em failures in Cu interconnects
- Baozhen Li
- Cathryn Christiansen
- et al.
- 2006
- IRPS 2006
Using Statistical Process Control to Monitor Active Managers
- Thomas K. Philips
- Emmanuel Yashchin
- et al.
- 2003
- Journal of Portfolio Management
The physical design of on-chip interconnections
- Mary Y.L. Wisniewski
- Emmanuel Yashchin
- et al.
- 2003
- IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Estimating the efficiency of collaborative problem-solving, with applications to chip design
- M.Y.L. Wisniewski
- E. Yashchin
- et al.
- 2003
- IBM J. Res. Dev
Parametric Modeling for Survival with Competing Risks and Masked Failure Causes
- Betty J. Flehinger
- Benjamin Reiser
- et al.
- 2002
- Lifetime Data Analysis
Survival with competing risks and masked causes of failures
- Betty J. Flehinger
- Benjamin Reiser
- et al.
- 1998
- Biometrika
Statistical inference for masked data
- Benjamin Reiser
- Emmanuel Yashchin
- et al.
- 1997
- Nonlinear Analysis, Theory, Methods and Applications
Change-point models in industrial applications
- Emmanuel Yashchin
- 1997
- Nonlinear Analysis, Theory, Methods and Applications