Systematic studies on reactive ion etch-induced deformations of organic underlayers
- Martin Glodde
- Sebastian Engelmann
- et al.
- 2011
- SPIE Advanced Lithography 2011
Publications
97 results for Karen Petrillo
Copper contact metallization using Ru-based barrier liners for 45 nm and 32 nm nodes: Reliability and device performance
- Soon-Cheon Seo
- Chih-Chao Yang
- et al.
- 2008
- ADMETA 2008
Copper contact metallization for 22 nm and beyond
- Soon-Cheon Seo
- Chih-Chao Yang
- et al.
- 2009
- IITC 2009
Overcoming the challenges of 22-nm node patterning through litho-design co-optimization
- Martin Burkharde
- J.C. Arnold
- et al.
- 2009
- SPIE Advanced Lithography 2009
Graded spin-on organic bottom antireflective coating for high NA lithography
- Dario L. Goldfarb
- Sean D. Burns
- et al.
- 2008
- SPIE Advanced Lithography 2008
22 nm technology compatible fully functional 0.1 μm 2 6T-sram cell
- B. Haran
- A. Kumar
- et al.
- 2008
- IEDM 2008
Graded spin-on organic bottom antireflective coating for high na immersion lithography
- Dario L. Goldfarb
- Libor Vyklicky
- et al.
- 2008
- J. Photopolym. Sci. Tech.
Are extreme ultraviolet resists ready for the 32 nm node?
- Karen Petrillo
- Yayi Wei
- et al.
- 2007
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
The effect of photoresist/topcoat properties on defect formation in immersion lithography
- G.M. Wallraff
- Carl E. Larson
- et al.
- 2007
- Proceedings of SPIE 2007
Initial experience establishing a EUV baseline lithography process for manufacturability assessment
- O.R. Wood II
- D. Back
- et al.
- 2007
- SPIE Advanced Lithography 2007