Publications

2 results for Van Truong

Three-dimensional chip stack with integrated decoupling capacitors and thru-si via interconnects
- - Bing Dang
  - Michael Shapiro
  - et al.
- 2010
- IEEE Electron Device Letters
Reliable through silicon vias for 3D silicon applications
- - M.J. Shapiro
  - M. Interrante
  - et al.
- 2009
- IITC 2009