Publications

7 results for John Torok

Analysis and evaluation methods associated with the application of compliant thermal interface materials in multi-chip electronic board assemblies
- - John Torok
  - Shawn Canfield
  - et al.
- 2011
- SEM Annual Conference on Experimental and Applied Mechanics 2011
Conference paper
Using in situ capacitance measurements to monitor the stability of thermal interface materials in complex PCB assemblies
- - Michael Gaynes
  - Timothy Chainer
  - et al.
- 2010
- IMAPS 2010
Conference paper
Packaging design of the IBM System z10 Enterprise Class platform central electronic complex
- - John G. Torok
  - Frank E. Bosco
  - et al.
- 2009
- IBM J. Res. Dev
Paper
Novel packaging of parallel-optical interconnects for high-end servers
- - Steven A. Rosenau
  - Jonathan Simon
  - et al.
- 2006
- OFC 2006
Conference paper
Novel packaging of parallel-optical interconnects for high-end servers
- - Steven A. Rosenau
  - Jonathan Simon
  - et al.
- 2005
- OFC/NFOEC 2005
Conference paper
Direct integration of dense parallel optical interconnects on a first level package for high-end servers
- - Evan G. Colgan
  - Bruce Furman
  - et al.
- 2005
- ECTC 2005
Conference paper
Novel packaging of parallel-optical interconnects for high-end servers
- - Steven A. Rosenau
  - Jonathan Simon
  - et al.
- 2005
- OFC 2005
Conference paper