Characterization of thin dielectric films as copper diffusion barriers using triangular voltage sweep
- S. Cohen
- J.C. Liu
- et al.
- 1999
- MRS Spring Meeting 1999
Paper
Publications
126 results for Ken Rodbell
Characterization of plated Cu thin film microstructures
- L. Gignac
- K.P. Rodbell
- et al.
- 1999
- MRS Spring Meeting 1999
Conference paperCharacterization of thin dielectric films as copper diffusion barriers using triangular voltage sweep
- S. Cohen
- J.C. Liu
- et al.
- 1999
- MRS Spring Meeting 1999
Conference paperMechanisms for microstructure evolution in electroplated copper thin films
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- MRS Spring Meeting 1999
Conference paperIn-situ study of Ti/TiN stability under nitrogen anneal
- P. DeHaven
- K.P. Rodbell
- et al.
- 1999
- MRS Spring Meeting 1999
Conference paperMechanisms for microstructure evolution in electroplated copper thin films near room temperature
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- Journal of Applied Physics
PaperLinewidth and underlayer influence on texture in submicrometer-wide Al and AlCu lines
- J.L. Hurd
- K.P. Rodbell
- et al.
- 1998
- Applied Physics Letters
PaperCharacterization of plated Cu thin film microstructures
- L. Gignac
- K.P. Rodbell
- et al.
- 1999
- MRS Spring Meeting 1999
Conference paperMechanisms for microstructure evolution in electroplated copper thin films
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- MRS Spring Meeting 1999
Conference paperControl of in-plane texture of body centered cubic metal thin films
- J.M.E. Harper
- K.P. Rodbell
- et al.
- 1997
- Journal of Applied Physics
Paper