Improved electromigration lifetime for copper interconnects using tantalum implant
- Jeff Gambino
- Timothy D. Sullivan
- et al.
- 2007
- MRS Spring Meeting 2007
Conference paper
Publications
126 results for Ken Rodbell
Alpha particle mitigation strategies to reduce chip soft error upsets
- C. Cabral
- K.P. Rodbell
- et al.
- 2007
- Journal of Applied Physics
PaperSingle-event-upset critical charge measurements and modeling of 65 nm silicon-on-insulator latches and memory cells
- David F. Heidel
- Kenneth P. Rodbell
- et al.
- 2006
- IEEE TNS
PaperOn the use of alloying elements for Cu interconnect applications
- K. Barmak
- C. Cabral
- et al.
- 2006
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
ReviewUnderlayer effects on texture evolution in copper films
- C.E. Murray
- K.P. Rodbell
- et al.
- 2006
- Thin Solid Films
PaperMetal-organic atomic layer deposition of metals for applications in interconnect technology
- O. Van Der Straten
- S.M. Rossnagel
- et al.
- 2005
- ECS Meeting 2005
Conference paperElectrodeposition of bismuth thin films on n-GaAs (110)
- Philippe M. Vereecken
- Kenneth Rodbell
- et al.
- 2005
- Applied Physics Letters
PaperMeasurement of the flux and energy spectrum of cosmic-ray induced neutrons on the ground
- M. Gordon
- P. Goldhagen
- et al.
- 2004
- IEEE TNS
PaperEvolution of microstructure in Ti-Ta bilayer thin films on polycrystalline-Si and Si(001)
- A.S. Özcan
- K.F. Ludwig Jr.
- et al.
- 2004
- Thin Solid Films
PaperStudies of deformation-induced texture development in sheet materials using diffraction techniques
- S.W. Banovic
- M.D. Vaudin
- et al.
- 2004
- Materials Science and Engineering: A
Paper