Microstructure control in semiconductor metallization
- J.M.E. Harper
- K.P. Rodbell
- 1997
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
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126 results for Ken Rodbell
Detection of current-induced vacancies in thin aluminum-copper lines using positrons
- P. Asoka-Kumar
- K. O'Brien
- et al.
- 1996
- Applied Physics Letters
Cu segregation at the Al(Cu)/Al2O3 interface
- M. Copel
- K.P. Rodbell
- et al.
- 1996
- Applied Physics Letters
Effect of copper on the microstructure and electromigration lifetime of Ti-AlCu-Ti fine lines in the presence of tungsten diffusion barriers
- A. Domenicucci
- R. Filippi
- et al.
- 1996
- Journal of Applied Physics
The role of texture in the electromigration behavior of pure aluminum lines
- D.B. Knorr
- K.P. Rodbell
- 1996
- Journal of Applied Physics
Effect of a surface layer on the stress relaxation of thin films
- M.D. Thouless
- K.P. Rodbell
- et al.
- 1996
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Cu segregation at the Al(Cu)/Al2O3 interface
- M. Copel
- K.P. Rodbell
- et al.
- 1995
- Applied Physics Letters
Correlation between special grain boundaries and electromigration behavior of aluminum thin films
- K.T. Lee
- J.A. Szpunar
- et al.
- 1995
- Canadian Metallurgical Quarterly
Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines
- C.-K. Hu
- K.P. Rodbell
- et al.
- 1995
- IBM J. Res. Dev
Correlation between special grain boundaries and electromigration behavior of aluminum thin films
- K.T. Lee
- J.A. Szpunar
- et al.
- 1995
- Canadian Metallurgical Quarterly