Publications

4 results for M.J. Shapiro

3D copper TSV integration, testing and reliability
- - Mukta Farooq
  - T. Graves-Abe
  - et al.
- 2011
- IEDM 2011
Conference paper
Three-dimensional chip stack with integrated decoupling capacitors and thru-si via interconnects
- - Bing Dang
  - Michael Shapiro
  - et al.
- 2010
- IEEE Electron Device Letters
Paper
Reliable through silicon vias for 3D silicon applications
- - M.J. Shapiro
  - M. Interrante
  - et al.
- 2009
- IITC 2009
Conference paper
CVD of fluorosilicate glass for ULSI applications
- - M.J. Shapiro
  - S. Nguyen
  - et al.
- 1995
- Thin Solid Films
Paper