64 nm pitch Cu dual-damascene interconnects using pitch split double exposure patterning schemeShyng-Tsong ChenHideyuki Tomizawaet al.2011IITC/MAM 2011
Qualification, monitoring, and integration into a production environment of the world's first fully programmable illuminatorGregory McIntyreDaniel Corlisset al.2011SPIE Advanced Lithography 2011
Fundamental investigation of Negative Tone Development (NTD) for the 22nm node (and beyond)Guillaume LandieYongan Xuet al.2011SPIE Advanced Lithography 2011