64 nm pitch Cu dual-damascene interconnects using pitch split double exposure patterning scheme
- Shyng-Tsong Chen
- Hideyuki Tomizawa
- et al.
- 2011
- IITC/MAM 2011
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Plasma etch challenges for porous low k materials for 32nm and beyond
- Catherine Labelle
- R. Srivastava
- et al.
- 2011
- CSTIC 2011