Publications

3 results for Y. Hirayama

Vacuum underfill technology for advanced packaging (IMPACT 2011)
- - M. Hoshiyama
  - M. Hasegawa
  - et al.
- 2011
- IMPACT 2011
Conference paper
Vacuum underfill technology for advanced packaging
- - Akihiro Horibe
  - M.-C. Paquet
  - et al.
- 2011
- ECTC 2011
Conference paper
Development of vacuum underfill technology for a 3D chip stack
- - Katsuyuki Sakuma
  - Sayuri Kohara
  - et al.
- 2011
- JMM
Paper