Cu CMP and its challenge for 20nm nodes and beyondJohn H. ZhangWei-Tsu Tsenget al.2012MRS Spring Meeting 2012
Post Cu CMP cleaning process evaluation for 32nm and 22nm technology nodesWei-Tsu TsengDonald Canaperiet al.2012ASMC 2012
Cu CMP edge uniformity improvement studies for 32 nm technology node and beyondJohn H. ZhangLaertis Economikoset al.2010MRS Online Proceedings Library