Publications

118 results for Gottlieb S. Oehrlein

Hollow Cathode Etching of Si and SiO₂ Using CF₄ and H₂
- - G. Fortuño-Wiltshire
  - G.S. Oehrlein
- 2019
- JES
Reactive ion Etching of Silicon and Silicon Dioxide in CF₄ Plasmas Containing H₂ or C₂F₄ Additives
- - J.P. Simko
- 2019
- JES
Near-Surface Damage and Contamination after CF₄/H₂ Reactive Ion Etching of Si
- - G.S. Oehrlein
  - R.M. Tromp
  - et al.
- 2019
- JES
Etch Selectivity of Silicon Dioxide over Titanium Silicide Using CF₄/H₂ Reactive Ion Etching
- - Steve W. Robey
  - Gottlieb S. Oehrlein
- 2019
- JES
Rethinking surface reactions in nanoscale dry processes toward atomic precision and beyond: A physics and chemistry perspective
- - Kenji Ishikawa
  - Tatsuo Ishijima
  - et al.
- 2019
- Japanese Journal of Applied Physics
Achieving ultrahigh etching selectivity of SiO₂ over Si₃N₄ and Si in atomic layer etching by exploiting chemistry of complex hydrofluorocarbon precursors
- - Kang Yi Lin
  - Chen Li
  - et al.
- 2018
- JVSTA
Polymer etching by atmospheric-pressure plasma jet and surface micro-discharge sources: Activation energy analysis and etching directionality
- - Andrew J. Knoll
  - Pingshan Luan
  - et al.
- 2018
- Plasma Processes and Polymers
Characterizing fluorocarbon assisted atomic layer etching of Si using cyclic Ar/C₄F₈ and Ar/CHF₃ plasma
- - Dominik Metzler
  - Chen Li
  - et al.
- 2016
- Journal of Chemical Physics
He plasma pretreatment of organic masking materials for performance improvement during pattern transfer by plasma etching
- - Dominik Metzler
  - Florian Weilnboeck
  - et al.
- 2016
- JVSTB
Application of cyclic fluorocarbon/argon discharges to device patterning
- - Dominik Metzler
  - Kishore Uppireddi
  - et al.
- 2016
- JVSTA