Extended tensor description to design non-uniform heat-removal in interlayer cooled chip stacks
- Thomas Brunschwiler
- Stephan Paredes
- et al.
- 2012
- ITherm 2012
Conference paper
Publications
6 results for H. Reichl
Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks
- Thomas Brunschwiler
- Stephan Paredes
- et al.
- 2011
- SEMI-THERM 2011
Conference paperHeat-removal performance scaling of interlayer cooled chip stacks
- Thomas Brunschwiler
- Stephan Paredes
- et al.
- 2010
- ITherm 2010
Conference paperHotspot-optimized interlayer cooling in vertically integrated packages
- T. Brunschwiler
- Bruno Michel
- et al.
- 2008
- MRS Fall Meeting 2008
Conference paperForced convective interlayer cooling in vertically integrated packages
- Thomas Brunschwiler
- Bruno Michel
- et al.
- 2008
- ITherm 2008
Conference paperInterlayer cooling potential in vertically integrated packages
- T. Brunschwiler
- Bruno Michel
- et al.
- 2008
- Microsystem Technologies
Paper