Publications

2 results for B. Himmel

Copper through silicon via (TSV) for 3D integration
- - C. Kothandaraman
  - B. Himmel
  - et al.
- 2012
- IRPS 2012
Conference paper
3D copper TSV integration, testing and reliability
- - Mukta Farooq
  - T. Graves-Abe
  - et al.
- 2011
- IEDM 2011
Conference paper