Publications

3 results for J. A. Busby

The IBM 4769 Cryptographic Coprocessor
- - J. A. Busby
  - E. N. Cohen
  - et al.
- 2020
- IBM J. Res. Dev
Extended abstract :C4NP - solder bumps for flip chip and microbumps for 3D
- - Klaus Ruhmer
  - David Hawken
  - et al.
- 2008
- GBC 2008
C4NP for Pb-free solder wafer bumping and 3D fine-pitch applications
- - D.Y. Shih
  - B. Dang
  - et al.
- 2008
- ICEPT-HDP 2008