Publications

5 results for B.Y. Kim

Electromigration in Cu(Al) and Cu(Mn) damascene lines
- - C.-K. Hu
  - J. Ohm
  - et al.
- 2012
- Journal of Applied Physics
Effects of Al and Mn impurities on Cu electromigration
- - C.-K. Hu
  - J. Ohm
  - et al.
- 2011
- ADMETA 2011
Effect of impurity on Cu electromigration
- - C.-K. Hu
  - Matthew Angyal
  - et al.
- 2010
- International Workshop STRESS-INDUCED PHENOMENA IN METALLIZATION 2010
High reliability 32 nm Cu/ULK BEOL based on PVD CuMn seed, and its extendibility
- - Takeshi Nogami
  - Tibor Bolom
  - et al.
- 2010
- IEDM 2010
CVD Co and its application to Cu damascene interconnections
- - Takeshi Nogami
  - J. Maniscalco
  - et al.
- 2010
- IITC 2010