Spacer defined double patterning for sub-72 nm pitch logic technology
- Ryoung-Han Kim
- Erin McLellan
- et al.
- 2010
- SPIE Advanced Lithography 2010
Conference paper
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Material and process for advanced Cu/ULK integration
- Chih-Chao Yang
- Daniel C. Edelstein
- et al.
- 2008
- ADMETA 2008
Conference paperOvercoming the challenges of 22-nm node patterning through litho-design co-optimization
- Martin Burkharde
- J.C. Arnold
- et al.
- 2009
- SPIE Advanced Lithography 2009
Conference paper